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Raman spectroscopy as a stress sensor in packaging: correct formulae for different sample surfaces

dc.contributor.authorChen, Jian
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-14T21:13:51Z
dc.date.available2021-10-14T21:13:51Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6101
dc.sourceIIOimport
dc.titleRaman spectroscopy as a stress sensor in packaging: correct formulae for different sample surfaces
dc.typeProceedings paper
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.beginpage1310
dc.source.endpage1317
dc.source.conferenceProceedings 52nd Electronic Components and Technology Conference
dc.source.conferencedate28/05/2002
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec


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