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Multilayer thin-film technology for future microwave systems-in-a-package integration

dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T21:23:46Z
dc.date.available2021-10-14T21:23:46Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6211
dc.sourceIIOimport
dc.titleMultilayer thin-film technology for future microwave systems-in-a-package integration
dc.typeOral presentation
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceIEEE Systems Packaging Japan Workshop
dc.source.conferencedate4/02/2002
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - imec


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