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Experimental validation of a star-shaped thermal compact model for underfilled flip chip assemblies

dc.contributor.authorDriessens, Evelien
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorCorlatan, D.
dc.contributor.authorRoose, E.
dc.date.accessioned2021-10-14T21:32:58Z
dc.date.available2021-10-14T21:32:58Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6289
dc.sourceIIOimport
dc.titleExperimental validation of a star-shaped thermal compact model for underfilled flip chip assemblies
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage46
dc.source.endpage49
dc.source.conferenceProceedings of the 8th International Workshop on Thermal Investigations of ICs and Systems - Therminic
dc.source.conferencedate1/10/2002
dc.source.conferencelocationMadrid Spain
imec.availabilityPublished - imec


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