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Cleaning, rinsing and drying issues in post-Cu CMP cleaning: a case study

dc.contributor.authorFyen, Wim
dc.contributor.authorVos, Rita
dc.contributor.authorVrancken, Evi
dc.contributor.authorGrillaert, J.
dc.contributor.authorMeuris, Marc
dc.contributor.authorHeyns, Marc
dc.date.accessioned2021-10-14T21:40:02Z
dc.date.available2021-10-14T21:40:02Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6341
dc.sourceIIOimport
dc.titleCleaning, rinsing and drying issues in post-Cu CMP cleaning: a case study
dc.typeProceedings paper
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorVrancken, Evi
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.source.peerreviewno
dc.source.beginpage69
dc.source.endpage95
dc.source.conferenceParticles on Surfaces 7: Detection, Adhesion and Removal
dc.source.conferencedate19/06/2000
dc.source.conferencelocationNewark, NJ USA
imec.availabilityPublished - imec


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