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Advanced wire bonding: bonding on copper

dc.contributor.authorHo, Meng
dc.contributor.authorLam, Kan Wai
dc.contributor.authorStoukatch, Serguei
dc.contributor.authorRatchev, Petar
dc.contributor.authorVath, C. J.
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T21:48:16Z
dc.date.available2021-10-14T21:48:16Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6396
dc.sourceIIOimport
dc.titleAdvanced wire bonding: bonding on copper
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage27
dc.source.endpage32
dc.source.conferenceProceedings of the European Microelectronics Packaging and Interconnection Symposium - IMAPS-EUROPE
dc.source.conferencedate16/06/2002
dc.source.conferencelocationCracow Poland
imec.availabilityPublished - imec


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