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Fine pitch copper wire bonding on copper bond pad process optimization

dc.contributor.authorLam, Kan Wai
dc.contributor.authorHo, Meng
dc.contributor.authorStoukatch, Serguei
dc.contributor.authorRatchev, Petar
dc.contributor.authorVath, C.J.
dc.contributor.authorSchervan, A.
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T22:07:44Z
dc.date.available2021-10-14T22:07:44Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6512
dc.sourceIIOimport
dc.titleFine pitch copper wire bonding on copper bond pad process optimization
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage63
dc.source.endpage68
dc.source.conference4th International Symposium on Electronic Materials and Packaging
dc.source.conferencedate3/12/2002
dc.source.conferencelocationKaohsiung Taiwan
imec.availabilityPublished - imec


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