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A quantitative adhesion study between contacting materials in Cu damascene structures

dc.contributor.authorLanckmans, Filip
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorVarga, Istvan
dc.contributor.authorPoortmans, Jef
dc.contributor.authorBender, Hugo
dc.contributor.authorConard, Thierry
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T22:08:14Z
dc.date.available2021-10-14T22:08:14Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6515
dc.sourceIIOimport
dc.titleA quantitative adhesion study between contacting materials in Cu damascene structures
dc.typeJournal article
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorPoortmans, Jef
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.contributor.orcidimecPoortmans, Jef::0000-0003-2077-2545
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.source.peerreviewno
dc.source.beginpage20
dc.source.endpage34
dc.source.journalApplied Surface Science
dc.source.issue1_4
dc.source.volume201
imec.availabilityPublished - imec


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