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A less critical cleaning procedure for silicon wafer using diluted HF dip and boiling in isopryl alcohol as final steps

dc.contributor.authorGomes dos Santos Filho, S.
dc.contributor.authorHasenack, Claus
dc.contributor.authorSalay, L. C.
dc.contributor.authorMertens, Paul
dc.date.accessioned2021-09-29T13:06:47Z
dc.date.available2021-09-29T13:06:47Z
dc.date.issued1995
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/660
dc.sourceIIOimport
dc.titleA less critical cleaning procedure for silicon wafer using diluted HF dip and boiling in isopryl alcohol as final steps
dc.typeJournal article
dc.contributor.imecauthorMertens, Paul
dc.source.peerreviewno
dc.source.beginpage902
dc.source.endpage907
dc.source.journalJ. Electrochem. Soc.
dc.source.volume142
imec.availabilityPublished - imec


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