A less critical cleaning procedure for silicon wafer using diluted HF dip and boiling in isopryl alcohol as final steps

Author(s)

Gomes dos Santos Filho, S.

;

Hasenack, Claus

;

Salay, L. C.

;

J. Electrochem. Soc.

2033 since deposited on 2021-09-29

2last month

Acq. date: 2025-12-07