A less critical cleaning procedure for silicon wafer using diluted HF dip and boiling in isopryl alcohol as final steps

Publication:

1995

Journal article

Author(s)

Gomes dos Santos Filho, S.

;

Hasenack, Claus

;

Salay, L. C.

;

J. Electrochem. Soc.

2041 since deposited on 2021-09-29

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Acq. date: 2026-08-04