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A less critical cleaning procedure for silicon wafer using diluted HF dip and boiling in isopryl alcohol as final steps

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dc.contributor.authorGomes dos Santos Filho, S.
dc.contributor.authorHasenack, Claus
dc.contributor.authorSalay, L. C.
dc.contributor.authorMertens, Paul
dc.contributor.imecauthorMertens, Paul
dc.date.accessioned2021-09-29T13:06:47Z
dc.date.available2021-09-29T13:06:47Z
dc.date.issued1995
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/660
dc.source.beginpage902
dc.source.endpage907
dc.source.journalJ. Electrochem. Soc.
dc.source.volume142
dc.title

A less critical cleaning procedure for silicon wafer using diluted HF dip and boiling in isopryl alcohol as final steps

dc.typeJournal article
dspace.entity.typePublication
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