dc.contributor.author | Opitz, Juliann | |
dc.contributor.author | Laidler, David | |
dc.date.accessioned | 2021-10-14T22:39:26Z | |
dc.date.available | 2021-10-14T22:39:26Z | |
dc.date.issued | 2002 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/6680 | |
dc.source | IIOimport | |
dc.title | Comparison of ATHENA and TTL alignment capability in product wafers | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Laidler, David | |
dc.contributor.orcidimec | Laidler, David::0000-0003-4055-3366 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 852 | |
dc.source.endpage | 862 | |
dc.source.conference | Metrology, Inspection, and Process Control for Microlithography XVI | |
dc.source.conferencedate | 4/03/2002 | |
dc.source.conferencelocation | Santa Clara, CA USA | |
imec.availability | Published - open access | |
imec.internalnotes | Proceedings of SPIE; Vol. 4689 | |