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Conference contributions
Dynamic compact thermal models for an ultra thin chip stacking technology
Publication:
Dynamic compact thermal models for an ultra thin chip stacking technology
Date
2002
Proceedings Paper
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6074.pdf
1.36 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Palacin, J.
;
Salleras, M.
;
Marco., S.
;
Marty, A.
;
Tasselli, J.
;
Van Hoof, Rita
;
Beyne, Eric
;
Vendier, O.
;
Coella-Vera, A.
Journal
Abstract
Description
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Views
2006
since deposited on 2021-10-14
421
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations
Metrics
Views
2006
since deposited on 2021-10-14
421
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations