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High density flip chip with adhesives on ceramics

dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorPodprocky, T.
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-14T23:41:26Z
dc.date.available2021-10-14T23:41:26Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6968
dc.sourceIIOimport
dc.titleHigh density flip chip with adhesives on ceramics
dc.typeProceedings paper
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.source.peerreviewno
dc.source.beginpage175
dc.source.endpage180
dc.source.conferenceProceedings of the European Microelectronics Packaging and Interconnection Symposium - IMAPS-EUROPE
dc.source.conferencedate16/06/2002
dc.source.conferencelocationCracow Poland
imec.availabilityPublished - imec


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