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Thermo-mechanical modelling of solder joint reliability for electronic package systems

dc.contributor.authorVandevelde, Bart
dc.date.accessioned2021-10-14T23:46:11Z
dc.date.available2021-10-14T23:46:11Z
dc.date.issued2002-03
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6989
dc.sourceIIOimport
dc.titleThermo-mechanical modelling of solder joint reliability for electronic package systems
dc.typePHD thesis
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.contributor.thesisadvisorVandepitte, D.
dc.contributor.thesisadvisorBaelmans, M.
imec.availabilityPublished - open access


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