Publication:
Thermo-mechanical modelling of solder joint reliability for electronic package systems
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Acq. date: 2026-01-10
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Acq. date: 2026-01-10
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1 since deposited on 2021-10-14
Acq. date: 2026-01-10
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2010 since deposited on 2021-10-14
4last month
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Acq. date: 2026-01-10
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