Publication:
Thermo-mechanical modelling of solder joint reliability for electronic package systems
Date
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.contributor.thesisadvisor | Vandepitte, D. | |
| dc.contributor.thesisadvisor | Baelmans, M. | |
| dc.date.accessioned | 2021-10-14T23:46:11Z | |
| dc.date.available | 2021-10-14T23:46:11Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2002-03 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/6989 | |
| dc.title | Thermo-mechanical modelling of solder joint reliability for electronic package systems | |
| dc.type | PHD thesis | |
| dspace.entity.type | Publication | |
| Files | Original bundle
| |
| Publication available in collections: |