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Parameter study for the reliability of underfilled flip chip and CSP assemblies

dc.contributor.authorVandevelde, Bart
dc.contributor.authorDegryse, Dominiek
dc.contributor.authorBeyne, Eric
dc.contributor.authorVandepitte, D.
dc.contributor.authorBaelmans, M.
dc.date.accessioned2021-10-14T23:47:20Z
dc.date.available2021-10-14T23:47:20Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6994
dc.sourceIIOimport
dc.titleParameter study for the reliability of underfilled flip chip and CSP assemblies
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage130
dc.source.endpage135
dc.source.conferenceProceedings of the European Microelectronics Packaging and Interconnection Symposium - IMAPS-EUROPE
dc.source.conferencedate14/06/2002
dc.source.conferencelocationCracow Poland
imec.availabilityPublished - imec


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