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Low cost wide temperature range adhesive flip-chip technology using a combination of ICA and NCA

dc.contributor.authorVanfleteren, Jan
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorPodprocky, T.
dc.date.accessioned2021-10-14T23:47:45Z
dc.date.available2021-10-14T23:47:45Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6996
dc.sourceIIOimport
dc.titleLow cost wide temperature range adhesive flip-chip technology using a combination of ICA and NCA
dc.typeMeeting abstract
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.source.peerreviewno
dc.source.conferenceIMAPS Flip-Chip Technology Workshop and Exhibition
dc.source.conferencedate24/06/2002
dc.source.conferencelocationAustin, TX USA
imec.availabilityPublished - imec


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