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Reduced temperature flip-chip technologies on flexible display substrates using adhesives

dc.contributor.authorVanfleteren, Jan
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorRaevens, S.
dc.contributor.authorMäättänen, J.
dc.contributor.authorPerttula, P.
dc.date.accessioned2021-10-14T23:48:12Z
dc.date.available2021-10-14T23:48:12Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6998
dc.sourceIIOimport
dc.titleReduced temperature flip-chip technologies on flexible display substrates using adhesives
dc.typeProceedings paper
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage92
dc.source.endpage95
dc.source.conferenceProceedings of the 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics - POLYTRONIC
dc.source.conferencedate23/06/2002
dc.source.conferencelocationZalaegerszeg Hungary
imec.availabilityPublished - open access


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