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Copper CMP challenges for ULK and advanced barriers

dc.contributor.authorVos, Ingrid
dc.date.accessioned2021-10-14T23:57:53Z
dc.date.available2021-10-14T23:57:53Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7039
dc.sourceIIOimport
dc.titleCopper CMP challenges for ULK and advanced barriers
dc.typeOral presentation
dc.contributor.imecauthorVos, Ingrid
dc.source.peerreviewno
dc.source.conference7th Annual International Conference on Chemical Mechanical Planarization
dc.source.conferencedate10/10/2002
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - imec


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