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Sealing of porous low-k dielectric materials: UV-O3 oxidised CVD silicon oxycarbide materials

dc.contributor.authorWhelan, Caroline
dc.contributor.authorCecchet, Francesca
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorSatta, Alessandra
dc.contributor.authorPireaux, Jean-Jaques
dc.contributor.authorMaex, Karen
dc.contributor.authorRudolf, Petra
dc.date.accessioned2021-10-15T00:01:09Z
dc.date.available2021-10-15T00:01:09Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7052
dc.sourceIIOimport
dc.titleSealing of porous low-k dielectric materials: UV-O3 oxidised CVD silicon oxycarbide materials
dc.typeJournal article
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.source.peerreviewno
dc.source.beginpage201
dc.source.endpage210
dc.source.journalPhysicalia Magazine
dc.source.issue3
dc.source.volume24
imec.availabilityPublished - imec


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