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Trends in MEMS/MST packaging and system integration

dc.contributor.authorBaert, Kris
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T03:59:37Z
dc.date.available2021-10-15T03:59:37Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7168
dc.sourceIIOimport
dc.titleTrends in MEMS/MST packaging and system integration
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceInternational MEMS/MST Industry Forum
dc.source.conferencedate31/03/2003
dc.source.conferencelocationMunich Germany
imec.availabilityPublished - imec


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