Show simple item record

Trends in wafer-level packaging of MEMS

dc.contributor.authorBaert, Kris
dc.contributor.authorDe Moor, Piet
dc.contributor.authorTilmans, Harrie
dc.contributor.authorJohn, Joachim
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Bavel, Mieke
dc.date.accessioned2021-10-15T03:59:41Z
dc.date.available2021-10-15T03:59:41Z
dc.date.issued2003-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7170
dc.sourceIIOimport
dc.titleTrends in wafer-level packaging of MEMS
dc.typeJournal article
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.imecauthorJohn, Joachim
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Bavel, Mieke
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage48
dc.source.endpage51
dc.source.journalOnboard Technology
dc.source.issueOct.
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record