| dc.contributor.author | Beyne, Eric | |
| dc.date.accessioned | 2021-10-15T04:01:09Z | |
| dc.date.available | 2021-10-15T04:01:09Z | |
| dc.date.issued | 2003 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/7206 | |
| dc.source | IIOimport | |
| dc.title | Multilayer thin film technology as an enabling technology for System-in-Package (SIP) and "above-IC" Processing | |
| dc.type | Oral presentation | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.source.peerreview | no | |
| dc.source.conference | 2nd International Symposium on Microelectronics and Packaging - ISMP | |
| dc.source.conferencedate | 23/09/2003 | |
| dc.source.conferencelocation | Seoul Korea | |
| imec.availability | Published - imec | |
