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Wafer level packaging interconnect technology

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T04:01:12Z
dc.date.available2021-10-15T04:01:12Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7207
dc.sourceIIOimport
dc.titleWafer level packaging interconnect technology
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceIEDM Short course "From Technology to System Design"
dc.source.conferencedate7/12/2003
dc.source.conferencelocationWashington DC USA
imec.availabilityPublished - imec


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