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Ultra thin chip stacking

dc.contributor.authorBeyne, Eric
dc.contributor.authorLabie, Riet
dc.date.accessioned2021-10-15T04:01:20Z
dc.date.available2021-10-15T04:01:20Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7210
dc.sourceIIOimport
dc.titleUltra thin chip stacking
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorLabie, Riet
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.source.peerreviewno
dc.source.conference3D System Integration Workshop
dc.source.conferencedate16/12/2003
dc.source.conferencelocationMünchen Germany
imec.availabilityPublished - imec


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