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dc.contributor.authorBruynseraede, Christophe
dc.contributor.authorChiaradia, David
dc.contributor.authorWang, Hui
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T04:04:38Z
dc.date.available2021-10-15T04:04:38Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7264
dc.sourceIIOimport
dc.titleEM-induced mass transport at the Cu/barrier interface: a new test structure for rapid assessment at user conditions
dc.typeProceedings paper
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.beginpage21
dc.source.endpage23
dc.source.conferenceProceedings of the IEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate2/06/2003
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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