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Moisture induced failures in flip chip on flex interconnections using anisotropic conductive adhesives

dc.contributor.authorCaers, J.F.J.M.
dc.contributor.authorZhao, X.J.
dc.contributor.authorLekens, Geert
dc.contributor.authorDreesen, R.
dc.contributor.authorCroes, K.
dc.contributor.authorWong, E.H.
dc.date.accessioned2021-10-15T04:04:54Z
dc.date.available2021-10-15T04:04:54Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7268
dc.sourceIIOimport
dc.titleMoisture induced failures in flip chip on flex interconnections using anisotropic conductive adhesives
dc.typeProceedings paper
dc.contributor.imecauthorLekens, Geert
dc.source.peerreviewno
dc.source.conferenceProceedings of the Business of Electronic Product Reliability and Reliability
dc.source.conferencedate13/01/2003
dc.source.conferencelocationHong-Kong
imec.availabilityPublished - imec


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