dc.contributor.author | Carchon, Geert | |
dc.contributor.author | Sun, Xiao | |
dc.contributor.author | De Raedt, Walter | |
dc.date.accessioned | 2021-10-15T04:06:08Z | |
dc.date.available | 2021-10-15T04:06:08Z | |
dc.date.issued | 2003 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/7283 | |
dc.source | IIOimport | |
dc.title | High-Q inductors and transmission lines on 20O.cm Si using wafer-level packaging technology | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Sun, Xiao | |
dc.contributor.imecauthor | De Raedt, Walter | |
dc.contributor.orcidimec | De Raedt, Walter::0000-0002-7117-7976 | |
dc.source.peerreview | no | |
dc.source.beginpage | 111 | |
dc.source.endpage | 114 | |
dc.source.conference | Proceedings of the Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems | |
dc.source.conferencedate | 9/04/2003 | |
dc.source.conferencelocation | Grainau Germany | |
imec.availability | Published - imec | |