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RF evaluation of low-cost leadless packages and devlopment of distributed electrical models

dc.contributor.authorChandrasekhar, Arun
dc.contributor.authorBrebels, Steven
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorNauwelaers, Bart
dc.contributor.authorVan Bever, T.
dc.date.accessioned2021-10-15T04:07:44Z
dc.date.available2021-10-15T04:07:44Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7303
dc.sourceIIOimport
dc.titleRF evaluation of low-cost leadless packages and devlopment of distributed electrical models
dc.typeProceedings paper
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.source.peerreviewno
dc.source.beginpage1550
dc.source.endpage1558
dc.source.conferenceProceedings of the 53rd Electronic Components and Technology Conference
dc.source.conferencedate27/05/2003
dc.source.conferencelocationNew Orleans, LA USA
imec.availabilityPublished - imec


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