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New failure analysis methods in microelectronics

dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-15T04:25:17Z
dc.date.available2021-10-15T04:25:17Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7462
dc.sourceIIOimport
dc.titleNew failure analysis methods in microelectronics
dc.typeProceedings paper
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.beginpage367
dc.source.endpage373
dc.source.conferenceEuroSime 2003. 4th International Conference on Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro
dc.source.conferencedate30/03/2003
dc.source.conferencelocationAix-en-Provence France
imec.availabilityPublished - imec


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