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Finite element modeling of shear test on bumped Cu-low K wafers

dc.contributor.authorDegryse, Dominiek
dc.contributor.authorLabie, Riet
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T04:27:47Z
dc.date.available2021-10-15T04:27:47Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7481
dc.sourceIIOimport
dc.titleFinite element modeling of shear test on bumped Cu-low K wafers
dc.typeOral presentation
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceIMAPS Copper/Low-K Semiconductors Workshop
dc.source.conferencedate15/12/2003
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec


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