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Mechanical behavior of BEOL structures containing lowK dielectrics during bonding process

dc.contributor.authorDegryse, Dominiek
dc.contributor.authorStoukatch, Serguei
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T04:27:55Z
dc.date.available2021-10-15T04:27:55Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7482
dc.sourceIIOimport
dc.titleMechanical behavior of BEOL structures containing lowK dielectrics during bonding process
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage815
dc.source.endpage820
dc.source.conferenceEPTC - Electronics Packaging Technology Conference
dc.source.conferencedate10/12/2003
dc.source.conferencelocationSingapore
imec.availabilityPublished - imec


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