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Mechanical FEM simulation of bonding process on Cu low K wafers

dc.contributor.authorDegryse, Dominiek
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T04:28:03Z
dc.date.available2021-10-15T04:28:03Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7483
dc.sourceIIOimport
dc.titleMechanical FEM simulation of bonding process on Cu low K wafers
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage345
dc.source.endpage351
dc.source.conferenceProceedings of the 4th Eurosime conference
dc.source.conferencedate30/03/2003
dc.source.conferencelocationAix-en-Provence France
imec.availabilityPublished - imec


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