dc.contributor.author | Fruehauf, Jens | |
dc.contributor.author | Lindsay, Richard | |
dc.contributor.author | Vandervorst, Wilfried | |
dc.contributor.author | Maex, Karen | |
dc.contributor.author | Bergmaier, A. | |
dc.contributor.author | Dollinger, G. | |
dc.contributor.author | Koch, F. | |
dc.date.accessioned | 2021-10-15T04:44:11Z | |
dc.date.available | 2021-10-15T04:44:11Z | |
dc.date.issued | 2003 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/7591 | |
dc.source | IIOimport | |
dc.title | Characterization of the B and As pile-up at the Si-SiO2 interface | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vandervorst, Wilfried | |
dc.contributor.imecauthor | Maex, Karen | |
dc.source.peerreview | no | |
dc.source.beginpage | 399 | |
dc.source.endpage | 404 | |
dc.source.conference | Ultra Shallow Junctions. 7th Int. Worksh. Fabrication, Characterization and Modeling of Ultra Shallow Doping Profiles in Semic. | |
dc.source.conferencedate | 27/04/2003 | |
dc.source.conferencelocation | Santa Cruz, CA USA | |
imec.availability | Published - imec | |