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Effect of transient pH on particle deposition during immersion rinsing

dc.contributor.authorFyen, Wim
dc.contributor.authorXu, Kaidong
dc.contributor.authorVos, Rita
dc.contributor.authorVereecke, Guy
dc.contributor.authorMertens, Paul
dc.contributor.authorHeyns, Marc
dc.date.accessioned2021-10-15T04:44:49Z
dc.date.available2021-10-15T04:44:49Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7595
dc.sourceIIOimport
dc.titleEffect of transient pH on particle deposition during immersion rinsing
dc.typeProceedings paper
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage139
dc.source.endpage143
dc.source.conferenceUltra Clean Processing of Silicon Surfaces 2002 - UCPSS
dc.source.conferencedate16/09/2002
dc.source.conferencelocationOostende Belgium
imec.availabilityPublished - open access
imec.internalnotesSolid-State Phenomena; Vol. 92


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