Show simple item record

Wafer-scale 0-level packaging of (RF-)MEMS devices using BCB

dc.contributor.authorJourdain, Anne
dc.contributor.authorZiad, Hocine
dc.contributor.authorDe Moor, Piet
dc.contributor.authorTilmans, Harrie
dc.date.accessioned2021-10-15T05:05:30Z
dc.date.available2021-10-15T05:05:30Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7712
dc.sourceIIOimport
dc.titleWafer-scale 0-level packaging of (RF-)MEMS devices using BCB
dc.typeProceedings paper
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorZiad, Hocine
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.beginpage239
dc.source.endpage244
dc.source.conferenceDesign, Test, Integration and Packaging of MEMS/MOEMS - DTIP of MEMS & MOEMS
dc.source.conferencedate5/05/2003
dc.source.conferencelocationCannes France
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record