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Material transport in copper-solder-micro-contacts under electric current

dc.contributor.authorMöller, A.
dc.contributor.authorTrenkler, Thomas
dc.contributor.authorGehring, T.
dc.contributor.authorMeusel, E.
dc.date.accessioned2021-09-29T13:11:43Z
dc.date.available2021-09-29T13:11:43Z
dc.date.issued1995
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/773
dc.sourceIIOimport
dc.titleMaterial transport in copper-solder-micro-contacts under electric current
dc.typeProceedings paper
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceMICRO MAT '95
dc.source.conferencedate28/11/1995
dc.source.conferencelocationBerlin Germany
imec.availabilityPublished - open access


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