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Impact of intermetallic formation and electro-migration on the integrity of bumped Cu/low-k Die

dc.contributor.authorLabie, Riet
dc.contributor.authorBeyne, Eric
dc.contributor.authorDegryse, Dominiek
dc.date.accessioned2021-10-15T05:15:28Z
dc.date.available2021-10-15T05:15:28Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7762
dc.sourceIIOimport
dc.titleImpact of intermetallic formation and electro-migration on the integrity of bumped Cu/low-k Die
dc.typeOral presentation
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceIMAPS Advanced Technology Workshop on Packaging Cu/low-k Semiconductors
dc.source.conferencedate15/12/2003
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec


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