Show simple item record

Investigation of the reliability of Cu and Co UBM layers in thermal-cycling tests

dc.contributor.authorLabie, Riet
dc.contributor.authorBeyne, Eric
dc.contributor.authorMertens, Robert
dc.contributor.authorRatchev, Petar
dc.contributor.authorHumbeeck, J.V.
dc.date.accessioned2021-10-15T05:15:40Z
dc.date.available2021-10-15T05:15:40Z
dc.date.issued2003-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7763
dc.sourceIIOimport
dc.titleInvestigation of the reliability of Cu and Co UBM layers in thermal-cycling tests
dc.typeProceedings paper
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorMertens, Robert
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage584
dc.source.endpage588
dc.source.conferenceEPTC - Electronics Packaging Technology Conference
dc.source.conferencedate10/12/2003
dc.source.conferencelocationSingapore Singapore
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record