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Investigation of Co UBM for direct bumping on Cu/lowK dies

dc.contributor.authorLabie, Riet
dc.contributor.authorBeyne, Eric
dc.contributor.authorRatchev, Petar
dc.date.accessioned2021-10-15T05:15:51Z
dc.date.available2021-10-15T05:15:51Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7764
dc.sourceIIOimport
dc.titleInvestigation of Co UBM for direct bumping on Cu/lowK dies
dc.typeProceedings paper
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage1230
dc.source.endpage1234
dc.source.conferenceProceedings of the 53rd Electronic Components and Technology Conference
dc.source.conferencedate27/05/2003
dc.source.conferencelocationNew Orleans, LA USA
imec.availabilityPublished - imec


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