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Global interconnect trade-off for technology over memory modules to application level: case study

dc.contributor.authorPapanikolaou, Antonis
dc.contributor.authorMiranda, Miguel
dc.contributor.authorCatthoor, Francky
dc.contributor.authorCorporaal, Henk
dc.contributor.authorDe Man, Hugo
dc.contributor.authorDe Roest, D.
dc.contributor.authorStucchi, M.
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T06:00:11Z
dc.date.available2021-10-15T06:00:11Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7972
dc.sourceIIOimport
dc.titleGlobal interconnect trade-off for technology over memory modules to application level: case study
dc.typeProceedings paper
dc.contributor.imecauthorCatthoor, Francky
dc.contributor.imecauthorDe Man, Hugo
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecCatthoor, Francky::0000-0002-3599-8515
dc.source.peerreviewno
dc.source.beginpage1
dc.source.endpage5
dc.source.conference5th ACM/IEEE Intl. Wsh. on System Level Interconnect Prediction
dc.source.conferencedate5/04/2003
dc.source.conferencelocationMonterey USA
imec.availabilityPublished - imec


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