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Statistical analysis and modelling of low-cost leadless packages for wireless applications based on non-destructive measurements
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Statistical analysis and modelling of low-cost leadless packages for wireless applications based on non-destructive measurements
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Date
2003
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Pfeiffer, Ullrich
;
Chandrasekhar, Arun
Journal
Abstract
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1856
since deposited on 2021-10-15
Acq. date: 2025-12-10
Citations
Metrics
Views
1856
since deposited on 2021-10-15
Acq. date: 2025-12-10
Citations