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Reliability and failure modes of SnAgCu solder joints for PSGA packages
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Authors
Ratchev, Petar
;
Vandevelde, Bart
;
Gonzalez, Mario
;
De Wolf, Ingrid
Conference
Proceedings of the IPC and Soldertec Global Conference on Lead Free Electronics
Title
Reliability and failure modes of SnAgCu solder joints for PSGA packages
Publication type
Proceedings paper
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