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Wafer-bonded thin-film surface-roughened light-emitting diodes

dc.contributor.authorRooman, Cathleen
dc.contributor.authorDe Jonge, Stijn
dc.contributor.authorKarnutsch, C.
dc.contributor.authorStreubel, K.
dc.contributor.authorKuijk, Maarten
dc.contributor.authorDutta, Barundeb
dc.contributor.authorBorghs, Gustaaf
dc.contributor.authorHeremans, Paul
dc.date.accessioned2021-10-15T06:26:03Z
dc.date.available2021-10-15T06:26:03Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8085
dc.sourceIIOimport
dc.titleWafer-bonded thin-film surface-roughened light-emitting diodes
dc.typeProceedings paper
dc.contributor.imecauthorDutta, Barundeb
dc.contributor.imecauthorBorghs, Gustaaf
dc.contributor.imecauthorHeremans, Paul
dc.contributor.orcidimecHeremans, Paul::0000-0003-2151-1718
dc.source.peerreviewno
dc.source.beginpage40
dc.source.endpage45
dc.source.conferenceLight-Emitting Diodes: Research, Manufacturing, and Applications VII
dc.source.conferencedate26/01/2003
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; Vol. 4996


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