Development of an electroless copper deposition bath for via fill applications on TiN seed layers
dc.contributor.author | Palmans, Roger | |
dc.contributor.author | Maex, Karen | |
dc.date.accessioned | 2021-09-29T13:15:38Z | |
dc.date.available | 2021-09-29T13:15:38Z | |
dc.date.issued | 1995 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/810 | |
dc.source | IIOimport | |
dc.title | Development of an electroless copper deposition bath for via fill applications on TiN seed layers | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Maex, Karen | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 87 | |
dc.source.endpage | 94 | |
dc.source.conference | Advanced Metallization for ULSI Applications in 1994 | |
dc.source.conferencedate | 4/10/1994 | |
dc.source.conferencelocation | Austin, TX USA | |
imec.availability | Published - open access | |
imec.internalnotes | Conference Proceedings ULSI-X |