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Stress Reduction in Tungsten CVD Films by RTA Post-Treatment of Ti/TiN Bilayers in Ammonia

dc.contributor.authorPalmans, Roger
dc.contributor.authorMouroux, Aliette
dc.contributor.authorZhang, S. L.
dc.contributor.authorPetersson, S.
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-09-29T13:15:38Z
dc.date.available2021-09-29T13:15:38Z
dc.date.issued1995
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/811
dc.sourceIIOimport
dc.titleStress Reduction in Tungsten CVD Films by RTA Post-Treatment of Ti/TiN Bilayers in Ammonia
dc.typeOral presentation
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.conferenceConference on Advanced Metallization and Interconnect Systems for ULSI Applications; October 3-5, 1995; Portland, Oregon, USA.
dc.source.conferencelocation
imec.availabilityPublished - imec


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