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Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers: overplating reliability considerations for the solder mask

dc.contributor.authorSiau, Sam
dc.contributor.authorDegrendele, Lieven
dc.contributor.authorDe Baets, Johan
dc.contributor.authorVan Calster, Andre
dc.date.accessioned2021-10-15T06:38:19Z
dc.date.available2021-10-15T06:38:19Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8136
dc.sourceIIOimport
dc.titleElectroless Ni/Au plating as a solderable finish on top of sequential buildup layers: overplating reliability considerations for the solder mask
dc.typeProceedings paper
dc.contributor.imecauthorDegrendele, Lieven
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.imecauthorVan Calster, Andre
dc.source.peerreviewno
dc.source.beginpage158
dc.source.endpage162
dc.source.conference26th International Spring Seminar on Electronics Technology. Integrated Management of Electronic Materials Production. ISSE
dc.source.conferencedate8/05/2003
dc.source.conferencelocationStara Lesna Slovakia
imec.availabilityPublished - imec


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