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Miniaturization using 3-D stack structure for SIP applications

dc.contributor.authorStoukatch, Serguei
dc.contributor.authorHo, Meng
dc.contributor.authorVaesen, Kristof
dc.contributor.authorWebers, Tomas
dc.contributor.authorCarchon, Geert
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Baets, Johan
dc.date.accessioned2021-10-15T06:51:53Z
dc.date.available2021-10-15T06:51:53Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8189
dc.sourceIIOimport
dc.titleMiniaturization using 3-D stack structure for SIP applications
dc.typeProceedings paper
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceProc. SMTA (Surface Mount Technology Association) International Conference
dc.source.conferencedate21/09/2003
dc.source.conferencelocationChicago, IL USA
imec.availabilityPublished - imec
imec.internalnotesCD-ROM Proceedings


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